1. 반도체의 핵심 부품인 Lead Frame 및 BOC 후공정 가공

2. Chip On Film 부품인 Lead Tape 생산

3. 반도체 제조 장비 및 자동검사장비(AVI)에 대한 개발, 설계 및 제조(PCB, Lead Frame, COF, LENS 등)

4. FCCSP, SOP, NSOP, BOC, CSP, SIP, UTS 등 회로기반 최종검사

5. IT & Digital 기기 CONNECT용 FFC 생산 (Flexible Flat Cable)

6. 글로벌 Machine Vision 업체인 코그넥스와의 협업을 통한 딥러닝 솔루션 제공

7. 3D 전문 업체인 인포앤과의 협업을 통해 2D 및 3D 통합 솔루션 제공

1. Processing after lead frame and BOC, which are the core components of semiconductors

2. Chip on Film Parts Lead Tape Parts

3. Development, design, and manufacture of semiconductor manufacturing equipment and automatic inspection equipment (AVI) (PCB, Lead Frame, COF, LENS, etc.)

4. Circuit-based final inspection of FCCSP, SOP, NSOP, BOC, CSP, SIP, UTS, etc

5. FFC Production for IT & Digital Devices CONNECT (Flexible Flat Cable)

6. Provides deep learning solutions through collaboration with global Machine Vision company COGNEX

7. 2D and 3D integrated solutions through collaboration with 3D specialist InfoN

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