반도체의 다양한 분야로 적용 가능한 수지 개질제
Resin modifiers applicable to various kind of semiconductor materials
for photoresists, underlayer, BARC, low Df CCL, EMC and packages
고기능 수지 가교제 Highly-functional resin cross-linkers
-Variety of organic cross linkers which can add excellent properties to base resins
-transparency, heat resistance, low volatility, adhesion
패키지 재료용 벤조옥사진 Benzoxazine for IC substrates
-Thermosetting resins suitable for IC substrates
-High heat resistance and low warpage
저유전 소재 Low-Df materials
-Cross-linkers for PPE and BMI resins
-Trade-off solution among several characteristics; flame resistance, adhesion, heat resistance and electrical properties (Df)
반도체 재료용 유기합성기술 소개
Organic synthesis technologies for semiconductor materials