MEMS 단위&일괄 공정 서비스 및 SOI 제작
MEMS 단위 공정 : Patterning process, Deposition process, Diffusion process, Etching process, Plating process, etc
MEMS 일괄 공정 : MEMS Structure, CPBT (Copper Post Bump TEG), TGVI (TGV Interposer), TSVI (TSV Interposer), Needle, Tip (Ni-Co EP), COG, etc
SOI 제작 : 2"~8" Device Layer 5~500um
MEMS foundry Service & SOI manufacturing
MEMS Foundry: Patterning process, Deposition process, Diffusion process, Etching process, Plating process, etc
MEMS turnkey process : MEMS Structure, CPBT (Copper Post Bump TEG), TGVI (TGV Interposer), TSVI (TSV Interposer), Needle, Tip (Ni-Co EP), COG, etc
SOI manufacturing : 2"~8" Device Layer 5~500um